Microstructure Evolution of W-Cu Alloy Wire  

Microstructure Evolution of W-Cu Alloy Wire

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作  者:Fei Shao Wenge Chen Hui Zhang Bingjun Ding 

机构地区:[1]School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, China [2]School of Science, Xi’an Jiaotong University, Xi’an, China

出  处:《Materials Sciences and Applications》2012年第3期157-162,共6页材料科学与应用期刊(英文)

摘  要:Microstructure of W-Cu alloy wire before and after hot-swaging was studied in this paper. Results show that a homogeneous microstructure of the W-Cu alloy wire was formed after hot-swaging treatment, and the tungsten particles were embedded in copper phases to form a networking structure;the W-Cu alloy wire has a microstructure of body-centered-cubic tungsten particles and face-centered-cubic copper phase, and did not change after hot-swaging. The intermediate phases have not been found during the process, but the size of the tungsten particles in the copper matrix becomes smaller. After hot-swaging, the treated W-Cu alloy wire has a relative density of 105.1%, and a conductivity of 47.2% IACS, the tensile and bending strength can be as large as 644 and 1600 MPa, respectively.Microstructure of W-Cu alloy wire before and after hot-swaging was studied in this paper. Results show that a homogeneous microstructure of the W-Cu alloy wire was formed after hot-swaging treatment, and the tungsten particles were embedded in copper phases to form a networking structure;the W-Cu alloy wire has a microstructure of body-centered-cubic tungsten particles and face-centered-cubic copper phase, and did not change after hot-swaging. The intermediate phases have not been found during the process, but the size of the tungsten particles in the copper matrix becomes smaller. After hot-swaging, the treated W-Cu alloy wire has a relative density of 105.1%, and a conductivity of 47.2% IACS, the tensile and bending strength can be as large as 644 and 1600 MPa, respectively.

关 键 词:Hot-Swaging Microstructure W-CU ALLOY WIRE 

分 类 号:TG1[金属学及工艺—金属学]

 

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