Thermal and Electrical Properties of Sn-Zn-Bi Ternary Soldering Alloys  

作　　者：M. A. Wadud M. A. Gafur M. R. Qadir M. O. Rahman 

机构地区：[1]Department of Physics, Jahangirnagar University, Savar, Bangladesh [2]PP&PDC, BCSIR, Dhaka, Bangladesh

出　　处：《Materials Sciences and Applications》2015年第11期1008-1013,共6页材料科学与应用期刊（英文）

摘　　要：Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.Sn-Zn based solder is a possible replacement of Pb solder because of its better mechanical properties. The alloys need to be studied and explored to get a usable solder alloy having better properties. In this work, eutectic Sn-9Zn and three Tin-Zinc-Bismuth ternary alloys were prepared and investigated their thermal and electrical properties. Thermo-mechanical Analysis and Differential Thermal Analysis were used to investigate thermal properties. Microstructural study is carried out with Scanning Electron Microscope. The alloys have single melting point. The co-efficient of thermal expansion and co-efficient of thermal contraction varies with alloy composition and temperature range. Electrical conductivity changes with Bi addition.

关 键 词：Lead Free Solder ALLOY EUTECTIC ALLOY DTA TMA Conductivity 

分 类 号：TG14[一般工业技术—材料科学与工程]