CHIPS

作品数:193被引量:628H指数:12
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相关领域:电子电信更多>>
相关作者:乐君杰朱依谆张杰张建武孙文平更多>>
相关机构:北京师范大学浙江大学复旦大学北京大学更多>>
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相关基金:国家自然科学基金国家社会科学基金国家高技术研究发展计划国家重点基础研究发展计划更多>>
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Deterministic quantum state and gate teleportation between distant superconducting chips
《Science Bulletin》2025年第3期351-358,共8页Jiawei Qiu Yang Liu Ling Hu Yukai Wu Jingjing Niu Libo Zhang Wenhui Huang Yuanzhen Chen Jian Li Song Liu Youpeng Zhong Luming Duan Dapeng Yu 
supported by the Key-Area Research and Development Program of Guangdong Province(2018B030326001);the National Natural Science Foundation of China(U1801661,12174178,12374471,12204228);the Guangdong Innovative and Entrepreneurial Research Team Program(2016ZT06D348);the Guangdong Provincial Key Laboratory(2019B121203002);the Science,Technology and Innovation Commission of Shenzhen Municipality(KYTDPT20181011104202253,KQTD20210811090049034,K21547502);the Shenzhen Science and Technology Program(RCYX20221008092907026);the Shenzhen-Hong Kong Cooperation Zone for Technology and Innovation(HZQB-KCZYB-2020050);the Natural Science Foundation of Beijing(Z190012);support from the Tsinghua University Initiative Scientific Research Program and the Ministry of Education of China.
Quantum teleportation is of both fundamental interest and great practical importance in quantum information science.To date,quantum teleportation has been implemented in various physical systems,among which supercondu...
关键词:Superconducting circuits Quantum network Quantum computing Flying microwave photon 
Two-substrate vertical deposition for stable colloidal crystal chips被引量:13
《Chinese Science Bulletin》2005年第8期765-769,共5页CHENXin SUNZhiqiang CHENZhimin ZHANGKai YANGBai 
supported by the National Natural Science Foundation of China(Grant Nos.90401020 and 200340062).
By combining vertical deposition with micro- molding in capillaries method, we have demonstrated the two-substrate vertical deposition, an alternative and versatile procedure for fabricating high-quality stable colloi...
关键词:胶状结晶芯片 模板 电子扫描 显微镜 
THE MAXIMUM NUMBER OF INTERSECTIONS BETWEEN TWO RECTANGULAR PATHS
《Chinese Science Bulletin》1992年第6期521-522,共2页李乔 徐俊明 张忠良 
Project supported by the National Natural Science Foundation of China. A preliminary version of this work was presented at the First Chinese SIAM Conference, Beijing. Nov. 1-3, 1990
In laying routes on printed circuit boards and VLSI chips, wires are usually allowed to run rectilinearly. This makes people consider the number of intersections between two rectangular paths on a plane. A Manhattan p...
关键词:Manhattan ENDPOINT CHIPS LAYING printed RECTANGULAR sharing allowed HAVEN 代军 
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