AI芯片用高阶任意层互联HDI电路板制作技术研究  

Research on fabrication technology of high order arbitrary layer interconnection HDI circuit board for AI chips

作　　者：叶大杰 简俊峰 柳小华 郑文浩 邹金龙 Ye Dajie;Jian Junfeng;Liu Xiaohua;Zheng Wenhao;Zou Jinlong

机构地区：[1]江门崇达电路技术有限公司,广东省智能工控印制电路板工程技术研究中心,广东江门529000

出　　处：《印制电路信息》2024年第S02期239-244,共6页Printed Circuit Information

摘　　要：人工智能技术的迅速崛起,已成为推动科技进步和社会发展的关键力量。随着AI芯片的复杂度不断提高,对于封装技术的要求也越来越严格,为了满足AI芯片对高性能、高密度电路板的需求,高密度互连(HDI)技术发挥着至关重要的作用。本文基于一款AI芯片用的18层9阶HDI产品,通过控制钻孔精度和层间对准度提高电路板的信号完整性和可靠性,对产品的激光钻孔、电镀填孔、层压等关键制造工艺进行技术分析,推动HDI电路板技术的进步,进一步促进AI芯片的可持续性发展。The rapid rise of artificial intelligence technology has become a key force to promote scientific and technological progress and social development.As the complexity of AI chips continues to increase,the requirements for packaging technology are becoming more and more stringent.In order to meet the needs of AI chips for high-performance,high-density circuit boards,high-density interconnect(HDI)technology plays a crucial role.Based on an 18-layer,9-order HDI product for AI chips,this paper improves the signal integrity and reliability of the circuit board by controlling drilling accuracy and interlayer alignment,and makes technical analysis on key manufacturing processes such as laser drilling,electroplating and lamination of the product,so as to promote the progress of HDI circuit board technology and further promote the sustainable development of AI chips.

关 键 词：AI芯片 任意层互联 HDI 激光钻孔 对准度 

分 类 号：TN41[电子电信—微电子学与固体电子学]