35及50μm激光盲孔加工技术的加工工艺开发  

Development of 35μm and 50μm laser blind hole processing technology

作　　者：蔡尧 许伟锚 姚廷杰 林壮澄 Cai Yao;Xu Weimao;Yao Tingjie;Lin Zhuangcheng

机构地区：[1]汕头超声印制板(二厂)有限公司,广东汕头515000

出　　处：《印制电路信息》2024年第S02期193-203,共11页Printed Circuit Information

摘　　要：随着电子产品的不断发展和小型化趋势的加速,PCB板小孔径的激光盲孔已经成为电子制造业中的一项关键技术。激光盲孔加工可以实现高密度电路连接,是HDI板件不可或缺的关键技术加工手段。提高PCB板的集成度和性能,同时减小产品尺寸和重量。本研究旨在对PCB板35及50μm盲孔加工的技术进行研究和总结,以利用当前我司所拥有的设备及对未来的需求进行前期研究和铺垫。希望能够给相关行业提供有价值的参考信息,推动PCB板制造技术的不断创新和发展。With the continous development of electronic products and the acceleration of miniaturization trend PCB plate small apertura laser blind hole has become a key technology in the electronics manufacturing industry.Laser blind hole processing can realize high-density circuit connention which is an indispensable key technical processing means of HDI plate which can improve the integration and performance of PCB board reduce product size and weight.The purpose of this study is to study and summarize the technology of PCB 35 and 50μm blind hole processing in order to make use of the current equipment owned by the company and conduct preliminary research and prave the way for the future needs.This paper hopes to provide valuable reference information to related industries and promote the continuous innovation and development of PCB board manufacturing technology.

关 键 词：HDI 激光 激光钻孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]