基于数字孪生概念的PCB镀铜工艺性能评估  

Performance evaluation of PCB copper plating process based on digital twin concept

作　　者：魏广玲 赵鹏 章哲 秦锦钧 Wei Guangling;Zhao Peng;Zhang Zhe;Qin Jinjun

机构地区：[1]上海交通大学轻合金精密成型国家工程研究中心,上海200240 [2]上海格麟倍科技发展有限公司,上海201100

出　　处：《印制电路信息》2024年第S02期51-55,共5页Printed Circuit Information

摘　　要：本论文以PCB(Printed Circuit Board)镀铜工艺为例,探讨了基于数字孪生概念的PCB镀铜工艺性能评估方法及其应用。通过数学建模、数值仿真和数据采集等手段,实现了镀铜过程的数字化表示,并基于此搭建了数字孪生模型。我们将此技术整合到传统的PCB镀铜工艺中,在PCB设计初期就通过数字孪生模型的输出结果,评估不同工艺参数对镀铜工艺性能的影响,从而提高一次设计成功率,减少样件修改,重制的次数,降低开发成本,提高产品质量。Taking PCB(Printed Circuit Board)copper plating process as an example,this paper discusses the performance evaluation method of PCB copper plating process based on digital twin concept and its application.By means of mathematical modeling,numerical simulation and data acquisition,the digital representation of copper plating process is realized,and a digital twin model is built based on this.This paper integrates this technology into the traditional PCB copper plating process,and evaluates the influence of different process parameters on the performance of copper plating process through the output results of digital twin model at the beginning of PCB design,so as to improve the success rate of a design,reduce the number of sample modification and remake,reduce the development cost,and improve the product quality.

关 键 词：数字孪生技术 仿真技术 镀铜工艺 印刷电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]