高速光模块金丝键合失效研究  

Failure study of wire bonding of high-speed optical modules

作　　者：刘江 荀宗献 房鹏博 黄德业 关志锋 梁丽萍 Liu Jiang;Xun Zongxian;Fang Pengbo;Huang Deye;Guan Zhifeng;Liang Liping

机构地区：[1]广州杰赛电子科技有限公司,广东广州510310 [2]珠海杰赛科技有限公司,广东珠海519170

出　　处：《印制电路信息》2024年第S02期342-350,共9页Printed Circuit Information

摘　　要：随着5G通信、互联网等先进技术的发展,通信领域对数据传输及时、稳定性的要求越来越高。目前,高速光模块产品展现出的高传输速率、高集成度、小体积、低功耗等优势使其迅速成为通信领域不可或缺的重要组件。当光模块电路板与光驱动芯片组合时,采用金丝键合(压焊,也称为绑定,是指使用金属丝进行绑定),并利用热压或超声能源,完成微电子器件中固态电路内部互连接线的连接,即芯片与电路或引线框架之间的连接。在金丝键合过程中会因印制电路板的影响导致金丝键合可靠性失效,而本文主要对印制电路板导致的金丝键合失效影响和芯片植球于印制电路板焊盘上的可靠性进行系统研究。With the development of advanced technologies such as 5G communication and the Internet,the requirements for the timeliness and stability of data transmission in the communication field are getting higher and higher.At present,high-speed optical module products have the advantages of high transmission rate,high integration,small size,and low power consumption,making them quickly become indispensable and important components in the communication field.When the optical module circuit board is combined with the optical driver chip,wire bonding is used pressure welding,also known as bonding,refers to the use of metal wires for bonding,and hot pressing or ultrasonic energy is used to complete the connection of the internal interconnect wires of the solid-state circuit in the microelectronic device,that is,the connection between the chip and the circuit or lead frame.In the process of wire bonding,the reliability of wire bonding will be caused by the influence of printed circuit boards,and this paper mainly studies the impact of wire bonding failure caused by printed circuit boards and the reliability of chip balling on the pads of printed circuit boards.

关 键 词：高速光模块 金丝键合 焊盘清洁度 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]