乙醛酸化学镀铜在孔金属化中的问题与对策  

Problems and countermeasures of glyoxylic acid for electroless copper plating in hole metallization

作　　者：林建辉 陈勇 陈干 刘毅 Lin Jianhui;Chen Yong;Chen Gan;Liu Yi

机构地区：[1]广东哈福技术股份有限公司,广东中山528403

出　　处：《印制电路信息》2024年第S01期216-220,共5页Printed Circuit Information

摘　　要：甲醛是化学镀铜中最为常见的还原剂,可是由于其强烈的挥发性和致癌性已经在印制电路板行业中越来越不受欢迎,而乙醛酸具有低毒、难挥发等优点越来越受到重视。然而以乙醛酸为还原剂制备的化学镀铜液,却有反应温度高、分解速度快和沉淀多等问题。针对上述问题,本文通过添加加速剂降低了乙醛酸化学镀铜反应温度;添加保护剂降低乙醛酸分解速度;另将常用的pH值调节剂从NaOH改成KOH从而减少了沉淀数量。最后,文章通过电阻率测试和扫描电镜等方式全面表征了铜层质量,证明以乙醛酸为还原剂的化学镀铜体系所制备铜层完全达到了印制电路板行业标准。Formaldehyde is the most common reducing agent in electroless copper plating.However,due to its strong volatility and carcinogenicity,it has become increasingly unpopular in the printed circuit board industry.Glyoxylic acid,on the other hand,is gaining more attention for its advantages of low toxicity and low volatility.Nevertheless,the chemical copper plating solution prepared using glyoxylic acid as a reducing agent faces challenges such as high reaction temperature,rapid decomposition,and excessive precipitation.In response to these issues,this study employed accelerators to reduce the reaction temperature of glyoxylic acid chemical copper plating.Protective agents were added to decrease the decomposition rate of glyoxylic acid,and the commonly used pH adjuster was changed from NaOH to KOH to reduce the amount of precipitation.Finally,the article comprehensively characterized the quality of the copper layer through resistance testing and scanning electron microscopy,proving that the copper layer prepared using glyoxylic acid as the reducing agent in the eletroless copper plating system fully meets the industry standards of PCB.

关 键 词：乙醛酸 化学镀铜 反应温度 分解 

分 类 号：TN41[电子电信—微电子学与固体电子学]