一种解决压延铜箔电镀后表面粗糙问题的微蚀液  

A microetching solution developed for solving surface roughness issue of RA copper foil after plating

作　　者：邵永存 李晓红 宣宇娜 章晓冬 刘江波 Shao Yongcun;Li Xiaohong;Xuan Yuna;Zhang Xiaodong;Liu Jiangbo

机构地区：[1]广东天承科技股份有限公司,广东广州511300 [2]上海天承化学有限公司,上海201500

出　　处：《印制电路信息》2024年第S01期210-215,共6页Printed Circuit Information

摘　　要：压延铜箔是通过对铜锭的反复轧制-退火工艺而成的,其铜原子呈不规则层状结晶,导致压延铜箔在后续的电镀铜过程中容易产生表面粗糙的问题。压延铜箔通常用于挠性线路板,线路表面越粗糙,则电阻越大,相应的信号延迟越大,信号质量越差。本文研制了一种用于化学镀铜前处理工艺的微蚀液,改变压延铜箔的表面形貌,提高电镀后铜箔表面平整度,形成的表面粗糙度(Ra)低于50 nm,表面轮廓最大高度(Rz)低于200 nm,为后续工艺打下良好基础。The rolled and annealing copper(RA)foil is produced by the repeated rolling and annealing process of copper ingot,in which the copper atoms form irregular layered crystals.This tends to yield rough surface appearance after electroplating of copper.RA foil is commonly used in Flexible Printed Circuit(FPC)manufacturing.Undesired resistance and signal delay will increase with the increase of copper trace surface roughness,leading to worse signal quality.A kind of microetching solution for pretreatment of electroless copper plating was developed,which can change the morphology of the RA foil and subsequently improve the surface flatness of copper surface after electroplating.Treated with this solution,the RA foil surface roughness(Ra)is less than 50nm with maximum height of the surface profile(Rz)less than 200nm,which lays a solid foundation for the follow-up process.

关 键 词：压延铜箔 挠性线路板 粗糙度 微蚀液 

分 类 号：TN41[电子电信—微电子学与固体电子学]