基于铑活化环氧树脂基板表面化学镀铜技术探究  

Research on electroless copper plating on the surface of epoxy resin substrate based on rhodium activation

作　　者：黄倩 王守绪 洪延 周国云 李玖娟 赖勃 孙炳合 毛永胜 周先文 Huang Qian;Wang Shouxu;Hong Yan;Zhou Guoyun;Li Jiujuan;Lai Bo;Sun Binghe;Mao Yongsheng;Zhou Xianwen

机构地区：[1]电子科技大学材料与能源学院,四川成都610054 [2]江西电子电路研究中心,江西萍乡337009 [3]江苏博敏电子有限公司,江苏盐城224100

出　　处：《印制电路信息》2024年第S01期168-174,共7页Printed Circuit Information

基　　金：江苏省重大科技成果转化项目(项目编号:BA2022060)的资助

摘　　要：环氧树脂基板被广泛应用于印制电路板生产中,由于基材本身惰性和较低表面能,不利于化学镀铜层的沉积,因而通常需要进行改性处理。本文提供了一种新型的环氧树脂基板化学镀铜工艺方法,将有机金属化合物Rh(C_(5)H_(7)O_(2))(CO)(PPh_(3))与双酚A型环氧树脂混合作为基材表面催化化学镀铜的活化改性层,再利用1 mol/L的硼氢化钠溶液进行40 min还原处理,最后进行化学镀铜。通过基板间剪切强度测试,发现得到的改性层与基板之间结合力较好,可满足PCB实际生产需求。利用粗糙度测试以及SEM测试分析,经过还原处理后的基材表面Ra=6.72 nm相较于未经过还原处理的基材改性层表面的Ra=5.43 nm有明显提升,从金相显微镜图和SEM测试图中可看出该技术制备的化学镀镀层表面的铜晶粒分布均匀且结晶致密,说明该化学镀铜工艺可得到表面平整光滑、厚度均匀的镀铜层。Epoxy resin substrate is widely used in the production of printed circuit boards.Due to its inertia and low surface energy,the substrate is not conducive to the deposition of electroless copper plating layer,so it usually needs modification treatment.In this paper,A new process of electroless copper plating on epoxy resin substrate is presented.The organic metal compound Rh(C_(5)H_(7)O_(2))(CO)(PPh_(3))is mixed with bisphenol A type of epoxy resin as the activated modification layer of catalytic electroless copper plating on the substrate surface,and the reduction treatment is carried out by 1mol/L sodium borohydride solution for 40min.Finally,the electroless copper plating is carried out.Through the test of inter-substrate shear strength,it is found that the binding force between the modified layer and the substrate is good,which can meet the actual production demand of PCB.According to the roughness test and SEM test analysis,Ra=6.72nm on the surface of the substrate after reduction treatment is significantly improved compared with Ra=5.43nm on the surface of the modified layer of the substrate without reduction treatment.It can be seen from the metallographic microscope and SEM test diagrams that the copper grains on the surface of the chemical plating layer prepared by this technology are evenly distributed and have dense crystals.It shows that the electroless copper plating process can obtain a smooth copper plating layer with uniform surface and thickness.

关 键 词：化学镀铜 表面改性 Rh(C_(5)H_(7)O_(2))(CO)(PPh_(3)) 还原处理 

分 类 号：TN41[电子电信—微电子学与固体电子学]