不同型号的增层胶膜在除胶渣氧化槽的兼容性研究  

Study on the compatibility of different types build-up films in the oxidation tank in desmear process

作　　者：田鸿洲 秦丹 冯后乐 宋景勇[1] Tian Hongzhou;Qin Dan;Feng Houle;Song Jingyong(Shanghai Meadville Science&Technology Co.,Ltd.,Shanghai 201613,China)

机构地区：[1]上海美维科技有限公司,上海201600

出　　处：《印制电路信息》2024年第S01期104-110,共7页Printed Circuit Information

摘　　要：FCBGA封装技术常用于集成电路芯片的封装和连接,而增层胶膜(build-up film)由于其优异的电特性和机械性能,在生产高效率信号封装载板时,是一种不可或缺的绝缘体材料。在FCBGA除胶渣流程中,氧化槽作用于胶膜表面并去除盲孔底部残胶。本次通过研究不同型号的增层胶膜在除胶渣氧化槽内混合生产测试,观察和对比产品前后表现,以此评估不同型号的增层胶膜是否互相兼容。研究结果表示,本文所研究的不同型号的增层胶膜在除胶渣氧化槽中可以相互兼容。FCBGA packaging technology is often used for the packaging and connection of integrated circuit chips,while build-up film is an indispensable edge material when producing high-efficiency signal sealing and loading boards due to its excellent electrical and mechanical properties.In the FCBGA Desmear process,the oxidation tank will coarsen the surface of the film and remove the residual glue at the bottom of the blind hole.This time,through the study of the mixed production test of different types of build-up films in Desmear oxidation tank,observe and compare the performance before and after the product,so as to evaluate whether different types of build-up films are compatible with each other.The research results show that different types of build-up films can be compatible with each other in Desmear oxidation tank.

关 键 词：FCBGA 增层胶膜 除胶渣 氧化槽 兼容性 

分 类 号：TN41[电子电信—微电子学与固体电子学]