高速材料与FR4材料混压CAF失效原因分析  

CAF failure analysis on hybrid with high speed and FR4 material

作　　者：刘昊 桂来来 任尧儒 Liu Hao;Gui Lailai;Ren Yaoru(SHENGYI ELECTRONICS CO.,LTD.DongGuan 523127,Guangdong,China)

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2024年第S01期319-324,共6页Printed Circuit Information

摘　　要：印制电路板耐导电阳极丝(CAF)性能是影响产品可靠性的重要因素,它通常发生在PCB基材中沿玻璃纤维到树脂界面上,从而导致两个相邻的导体之间绝缘性能下降甚至造成短路,是PCB产生故障的一个重大潜在危险的根源。文章通过对高速材料与FR4板材混压可靠性认证时发生CAF失效进行分析,找到产生CAF问题的成因,进而提出改善措施。为后续产品制作提供借鉴,降低PCB产品发生可靠性问题的风险。The performance of conductive anodic filament(CAF)is an important factor affecting the reliability of printed circuit board,which usually occurs in the PCB substrate along the glass fiber to the resin interface,resulting in a decrease in insulation performance between two adjacent conductors or even a short circuit,which is a major potential source of PCB failure.This paper analyzes the CAF failure in the reliability certification of high speed materials and FR4 hybrid,finds out the cause of CAF problem,and puts forward the improvement measures.It provides reference for subsequent product production and reduces the risk of reliability problems of PCB products.

关 键 词：高速PCB 混压 CAF失效 

分 类 号：TN41[电子电信—微电子学与固体电子学]