特殊凹腔印制板压合阻胶方案研究  

Study on solution of resin-flow resistant in pressing process for special cavity printed board

作　　者：付艺 吴超 孙驰 Fu Yi;Wu Chao;Sun Chi(Zhuhai Founder PCB Development Limited.PCB Institute,Guangdong,Zhuhai 519175)

机构地区：[1]珠海方正电路板发展有限公司-研究院,广东珠海519175

出　　处：《印制电路信息》2023年第S02期206-211,共6页Printed Circuit Information

摘　　要：对于一种槽底有导通孔、槽壁非金属化设计的特殊凹腔印制板,采用带有导通孔的母板与带有非金属化槽的子板压合、烧结制作工艺,其关键技术是阻止半固化片流胶污染槽底金属化区域。通过测试半固化片铣空区补偿和PTFE垫片两种阻胶方案,初步探索出特殊凹腔印制板的压合工艺,为此类样板的制作提供了可行的技术方案。Adopt pressing and sintering processes between mother board with plating through hole(PTH)and daughter board with non PTH cavity to manufacture a special cavity printed board designed with PTH in bottom and nonmetallized slot wall,the key technique is to resist prepreg resin flow and polluting metallized area in bottom of the cavity.Through studying two type of resin flow resistant solutions with milling compensation of prepeg and PTFE spacer,initially track out pressing technology for special cavity printed board,so as to provide a feasible technical proposal to fabricate samples.

关 键 词：凹腔印制板 阻胶 压合 半固化片 PTFE垫片 

分 类 号：TN41[电子电信—微电子学与固体电子学]