VCP脉冲填孔电镀铜研究  

Blind microvias filling with electroplated copper using reverse pulse plating on VCP line

作　　者：熊海平 牟星宇 刘杰 明东远 Xiong Haiping;Mu Xingyu;Liu Jie;Ming Dongyuan

机构地区：[1]广东天承科技股份有限公司,广东广州511338

出　　处：《印制电路信息》2022年第S01期281-286,共6页Printed Circuit Information

摘　　要：文章介绍了一种VCP电镀线上使用脉冲电源和不溶解性阳极进行电镀铜填充盲孔的工艺。提出了一种使用不溶性阳极进行电镀时避免阳极表面产生氧气的方法。提供了一种溶解纯铜粒的铜离子补加方法用以替代传统的溶解氧化铜粉的方式。研究了不同的脉冲参数设置如:正向、反向电流密度,正向、反向脉宽参数等对盲孔填充效果及镀层性能的影响。This paper introduces a copper electroplating technology for blind microvias filling using pulse power supply and insoluble anode in VCP line.It proposes a method to avoid oxygen generation on the surface of insoluble anode during electroplating,and it provides a copper ion addition method for dissolving pure copper particles which can replace the traditional way of dissolving the copper oxide powder.This paper has also discussed effects of different pulse parameters,such as forward and reverse current density,forward and reverse pulse width parameters on blind microvias filling and coating properties.

关 键 词：VCP电镀生产线 脉冲电源 电镀铜 盲孔填充电镀 

分 类 号：TN41[电子电信—微电子学与固体电子学]