面向5G通信的电解铜箔表面粗化处理研究  

Research on coarsening surface treatment of electrolytic copper foil for 5G communication

作　　者：文雯 周国云 王翀 何为 张仁军 艾克华 李清华 马朝英 郭珊 Wen wen;Zhou Guoyun;Wangchong;Hewei;Zhang Renjun;Ai Kehua;Li Qinghua;Ma Chaoying;Guo Shan

机构地区：[1]电子科技大学材料与能源学院,四川成都610054 [2]四川英创力电子科技股份有限公司,四川遂宁636400 [3]四川省华兴宇电子科技有限公司,四川德阳618412

出　　处：《印制电路信息》2021年第S02期358-364,共7页Printed Circuit Information

摘　　要：伴随着第五代移动通信技术应用的落地,人们对移动通信终端设备的高频高速需求日益凸显。其中除了5G上游的半导体行业,电解铜箔作为承载半导体电子元器件并实现电气互联的印制电路板(PCB,Printed Circuit Board)的三大原材料之一,也面临着高频化和高速数字化的挑战。文章针对目前高频信号传输应用中铜箔表面粗化处理效果不佳的情况,通过扫描电子显微镜、3D激光显微镜和电化学测试等技术手段研究了电流密度和复合添加剂对铜箔粗化结晶形貌和电化学性能的影响。结果表明复合添加剂能够有效调控粗化层晶粒大小和形态,改善铜箔的表面粗糙度,将粗大且杂乱分布的微米级树枝状结晶调控为尺寸为500 nm左右、较为均匀分布的近球状结晶,表面粗糙度Ra和Rz分别为0.258μm和1.223μm,该性能指标著优于粗化基础液;复合添加剂能够提升粗化镀液的极化能力,减少表面毛刺。研究铜箔表面粗化处理,对降低信号传输损耗、实现超精细线路和促进高频高速PCB发展有着重要意义。With the application of the fifth generation mobile communication technology people’s demand has become increasingly strong for high-frequency and high-speed mobile communication terminal equipment.In addition to the semiconductor industry which is the upstream of 5 G electrolytic copper foil as one of the three major raw materials of PCB that is used to carry semiconductor electronic components and realize electrical interconnection is also facing the challenge of high-frequency and high-speed digitalization.In this article focusing on the poor coarsening effect of copper foil in the application of high-frequency signal transmission scanning electron microscope 3 D laser microscopy and electrochemical tests were employed to study effects of current density and composite additives on the coarsening crystallization morphology and electrochemical performance of copper foil.The results showed that composite additives can effectively control surface grain size and morphology of the coarsening layer improve the surface roughness of copper foil,and adjust coarse and disorderly distributed micron dendrites into relatively uniform distribution of nearly spherical crystals with the size of about 500 nm.The surface roughness Ra and Rz are 0.258μm and 1.223μm respectively、significantly better than that in coarsening sample treatment.Composite additives can improve the polarization ability of the coarsening bath,and reduce surface burrs.It is of great significance to investigate the surface roughening of copper foil,in which reducing signal transmission loss,realizing ultra-fine circuits and promoting the development of high-frequency and high-speed PCB are highly important.

关 键 词：电解铜箔 粗化处理 复合添加剂 表面粗糙度 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TN929.5[金属学及工艺—金属材料]