5G高频LCP带胶材料UV激光盲孔品质改善研究  

Research on the quality improvement of UV laser blind hole of 5G high frequency LCP adhesive material

作　　者：赵城 田新博 刘宏伟 潘丽 Zhao Cheng;Tian Xinbo;Liu Hongwei;Pan Li

机构地区：[1]安捷利(番禺)电子实业有限公司研发中心,广东广州511458 [2]安捷利(番禺)电子实业有限公司,广东广州511458

出　　处：《印制电路信息》2021年第S01期172-178,共7页Printed Circuit Information

摘　　要：为了满足5G时代产品的性能需求,新型LCP材料与高频胶的投入使用,使得以往的工艺加工方法无法达到现阶段产品质量要求,对于带胶产品激光盲孔而言,主要存在胶内缩严重和孔型差的问题。文章首先通过介绍激光钻孔原理,了解激光钻孔过程可能存在的影响性因子,接着通过鱼骨图分析,找出影响激光盲孔质量的关键因素后,进行相关的正交实验设计,验证激光功率、频率、扫描速度、Z轴高度参数的设定对盲孔品质的影响,获得了此类叠构盲孔的一阶盲孔加工的最佳工艺方法和参数。In order to meet the performance requirements of products in the 5G era,new LCP materials and high-frequency glue were put into use,making the previous processing methods unable to meet the current product quality requirements.For laser blind holes with adhesive products,there are mainly serious shrinkage in glue and poor pass shape.By introducing the principle of laser drilling,laser drilling process possible influential factors,and then through the fishbone diagram analysis,this paper finds out the key factors affecting the quality of laser blind holes.By the associated orthogonal experiment design,it verifies the laser power,frequency,scanning speed,height of Z axis parameters setting influencing quality of blind holes.It gets this kind of fold structure of one order blind hole and the best technology of blind hole methods and parameters.

关 键 词：高频 UV激光 盲孔 

分 类 号：TN41[电子电信—微电子学与固体电子学] TN249