波峰焊通孔填充不良失效分析  

Failure analysis of poor through hole fill in wave soldering process

作　　者：谢世威 李志成 马宗理 付登胜 XIE Shi-wei;LI Zhi-cheng;MA Zong-li;FU Deng-sheng

机构地区：[1]广合科技(广州)有限公司,广东广州510730

出　　处：《印制电路信息》2017年第A02期186-195,共10页Printed Circuit Information

摘　　要：通孔填充不良是波峰焊过程中比较常见的问题,通孔填充不良会导致焊点的机械强度大幅下降,甚至影响导电性能.文章主要是对服务器板通孔填充不良的失效分析方法进行研究,对常见的通孔填充不良失效案例进行分析说明,对通孔填充不良失效分析建立有效分析步骤和方法,从而能快速的对不良失效进行原因分析定位和指导下一步的纠正预防改善.Poor through hole fill is more common in the process of wave soldering.Poor through hole fill would cause a decline in solder.joint mechanical strength greatly,and even affect the conductivity.This article mainly studies on the failure analysis methods of poor through hole fill of the Sever.analyzes with some common cases of poor through hole fill,establishes effective analysis steps and methods for poor through hole fill.Therefor it can realize the real failure cause of the failure rapidly and give out the guidance of corrective and preventive improvement for the next step.

关 键 词：通孔 波峰焊 填充不良 失效分析 服务器 

分 类 号：TN41[电子电信—微电子学与固体电子学]