多层电路板凹蚀工艺能力提升研究  

The improvement of etch back ability on multilayer printed circuit board

作　　者：曹权根 冷科 管育时 刘金峰 CAO Quan-gen;LENG Ke;GUAN Yu-Shi;LIU Jin-feng

机构地区：[1]深南电路股份有限公司,广东深圳518117

出　　处：《印制电路信息》2017年第A02期112-123,共12页Printed Circuit Information

摘　　要：等离子技术在PCB领域已经广泛应用,主要应用于清洁、活化和凹蚀,其中凹蚀应用最广泛.文章以孔的密集程度、内层铜层次及厚径比为因子,设计不同孔型的试验板;以去钻污功率、时间、温度和真空度为试验因子,设计正交试验,研究了不同去钻污参数对试验板凹蚀效果的影响,并对其影响进行评估,找到了不同厚径比条件下的最佳凹蚀参数,其结果可作为凹蚀最优化生产的参考.Nowadays,plasma technology has been applied in various fields of PCBs,such as cleaning,activation and etchback,but it is mainly applied in etchback.In this paper,we designed test panels with intensity of hole,inner layer copper level and aspect ratio as experimental factor.Furthermore,we designed orthogonal experiment with power,time,temperature,vacuum degree as experimental factors,and did experiments to analyze the effects of different plasma parameters to etchback.In the end,the optimal plasma parameters of different test panels were identified respectively,and the results can be used as reference of plasma production.

关 键 词：等离子 凹蚀 正交试验 

分 类 号：TN41[电子电信—微电子学与固体电子学]