射流电铸快速成型纳米晶铜的组织与性能  

Microstructure and Properties of Nanocrystalline Copper Prepared by Rapid Prototyping Oriented by Jet Electroforming

作　　者：赵阳培[1] 葛世荣[1] 张君伟[2] 黄因慧[3] 

机构地区：[1]中国矿业大学材料科学与工程学院,江苏徐州221008 [2]徐州建筑职业技术学院机电工程系,江苏徐州221008 [3]南京航空航天大学机电工程学院,江苏南京210016

出　　处：《机械工程材料》2008年第1期37-39,共3页Materials For Mechanical Engineering

基　　金：国家自然科学基金资助项目(50175053)

摘　　要：采用射流电铸快速成型方法制备了纳米晶铜铸层,并用SEM、XRD等方法对纳米晶铜铸层表面形貌、微观组织结构以及晶粒大小进行了分析,对纳米晶铜铸层的力学性能进行了测试。结果表明:在电铸电流密度为300 A.dm-2时,制备的纳米晶铜平均晶粒尺寸为47.4 nm,纳米晶铜铸层的抗拉强度为470 MPa,伸长率为14%,抗拉强度是粗晶铜的3.6倍。The method of rapid prototyping oriented by jet electroforming was used to prepare bulk nanocrystalline copper.The surface morphology,microstructure,grain sizes of the copper deposit were studied by means of SEM and XRD,and the mechanical properties of nanocrystalline copper were also measured.The results show that the average grain size of the bulk nanocrystalline copper fabricated with current density of 300 A·dm-2 is about 47.4 nm,the tensile strength and tensile ductility of the nanocrystalline copper r...

关 键 词：射流电铸 纳米晶铜 微观结构 力学性能 

分 类 号：TB381[一般工业技术—材料科学与工程]