无铅BGA封装可靠性的跌落试验及焊接界面微区分析  

Mechanical Test on Reliability of Lead-free BGA Assembly and Microstructure Analysis of Soldering Interface

作　　者：祁波[1] 朱笑鶤[1] 陈兆轶[1] 王家楫[1] 

机构地区：[1]复旦大学国家微分析中心材料科学系,上海200433

出　　处：《复旦学报（自然科学版）》2006年第6期694-701,共8页Journal of Fudan University：Natural Science

基　　金：复旦-三星可靠性联合实验室基金资助项目

摘　　要：通过进行BGA封装的可靠性力学试验(高加速度跌落试验),研究了机械冲击和应力对无铅BGA封装焊点的可靠性的影响,并通过对失效BGA封装焊点的微观结构和成分的SEM/EDX分析,寻找影响焊点可靠性的主要因素,研究结果表明,焊点的失效模式较为复杂,而在多数情况下,焊点的疲劳失效与焊接界面处的金属间化合物IMC层断裂有关,并对无铅焊料IMC的性质也作了研究.A mechanical test(drop test) of reliability for Lead-free BGA assembly was introduced to evaluate the reliability of BGA assembly under the mechanical shock and thermal stress.And further research on the microstructure and composition of soldering joints in failed BGA assemblies was carried out to find out the major cause undermining the reliability.The test result showed the failure mechanism was complicated and the failure of the soldering interface was related to the IMC fracture behavior in most cases.T...

关 键 词：无铅BGA封装 可靠性跌落试验 金属间化合物(IMC) 

分 类 号：TN605[电子电信—电路与系统]