自然循环回路内芯片的强化沸腾换热研究  

ENHANCED BOILING HEAT TRANSFER OVER A SILICON CHIP IN A NATURAL CIRCULATION LOOP

作　　者：魏进家[1] 权晓波[2] 本田博司[3] 

机构地区：[1]西安交通大学动力工程多相流国家重点实验室,陕西西安710049 [2]北京宇航系统工程研究所,北京100076 [3]九州大学,日本福冈8168580

出　　处：《工程热物理学报》2007年第z1期225-228,共4页Journal of Engineering Thermophysics

基　　金：教育部科学技术研究重点项目(No.106142);国家重点基础研究发展资助项目资助(No.2006CB601203)

摘　　要：针对电子器件的高效冷却问题,对自然循环回路系统内表面加工有方柱形微结构的硅片上FC-72的强化沸腾换热性能进行了实验研究。测试了两个芯片,其表面上的方柱形微结构的边长均为30μm,但高度分别为60μm和200μm。沸腾介质的过冷度设为10 K、25 K和35 K。随着壁面过热度的增加,微结构表面芯片上的热流密度急剧增加且临界热流密度时芯片的表面温度低于芯片回路正常工作的临界上限温度85℃,这与其在池沸腾换热中的特点一样。但临界热流密度值与池沸腾情况相比有所降低。For efficiently cooling electronic components,experiments were conducted to study the boiling heat transfer performance of FC-72 over micro-pin-finned silicon chips in a natural circulation loop system.Two micro-pin-finned chips having the same fin thickness of 30μm and different fin height of 60 and 200μm,respectively,were tested.The liquid subcoolings were set to 10,25 and 35 K respectively.For the two micro-pin-finned chips,the boiling curves for all subcoolings showed a sharp increase in heat flux with increasing wall superheat and the wall temperature at the critical heat flux was less than the upper limit for the reliable operation of LSI chips,85℃,which were similar to those for pool boiling.However,the critical heat flux was lower for the natural circulation loop.

关 键 词：芯片冷却 方柱形微结构 强化沸腾换热 自然循环 

分 类 号：TQ051.5[化学工程]