AlN陶瓷与无氧铜的活性封接  

Active Brazing of AlN and Oxygen-Free Copper

作　　者：刘鑫[1] 张小勇[1] 陆艳杰[1] 方针正[1] 楚建新[1] 

机构地区：[1]北京有色金属研究总院,北京100088

出　　处：《真空电子技术》2007年第4期56-58,共3页Vacuum Electronics

摘　　要：采用Ag-Cu-Ti活性钎料对AlN陶瓷与无氧铜进行了钎焊。通过对焊接件气密性的测试、陶瓷/金属结合界面的微观分析以及界面化学反应的热力学计算,得出以下结论:Ag-Cu-Ti2.0钎料可以实现AlN与无氧铜的气密封接,漏气速率Q<10×10-8Pa.L/s;钎料与陶瓷界面存在一定厚度的化学反应区,反应产物主要是TiN。AlN ceramic and oxygen-free copper had been brazed using Ag-Cu-Ti active alloy.We tested the airtight capability of the brazing sample,analyzed the microstructures at the brazing interface,and calculated the thermodynamics factors on the brazing chemic reaction.The results indicated that Ag-Cu-Ti2.0 brazing filler metal can join AlN with oxygen-free copper directly,its rate of air leakage Q<10×10-8 Pa·L/s,and there was a chemic reaction area which had an appropriate thickness,and the final reaction productions were mostly TiN.

关 键 词：AG-CU-TI 活性钎焊 微观分析 

分 类 号：TB756[一般工业技术—真空技术]