半导体抛光晶片缺陷的光学无损检测研究  

The Study of Optical Non-Damage In spection of Semiconductor Wafer's Defects

作　　者：冯玢 王利杰 

机构地区：[1]信息产业部电子第四十六研究所,天津300192

出　　处：《现代仪器》2001年第3期15-17,共3页Modern Instruments

摘　　要：抛光晶片缺陷检测是半导体材料生产和器件生产中的一个重要环节,晶片质量及器件成品率与缺陷检测的成功与否有着相当重要的关系。本文重点介绍了利用我国古代劳动人民发明的透光镜原理建立的抛光晶片激光无损缺陷检测技术和相应的仪器系统,并对一系列缺陷的测试和实验分析结果进行了相应的讨论。The inspection of wafer's quality is very important for semiconductor production enterprises and component/IC production enterprises. The effectiveness of detection method will predicate the possiable rate for wafer or component/IC. Here, a non-destructive inspecting instrument was developed that is optical method using laser and is based on a Chinese ancient invention 'Magic Mirror'.Moreover, in this document,some defect's image and experimental results are discussed.

关 键 词：透光镜 抛光晶片 缺陷 光学无损检测技术 表面质量分析系统 

分 类 号：TH7[机械工程—仪器科学与技术]