矩形片式电阻半导体激光钎焊无铅焊点的热循环试验  

Thermal cycling of rectangular chip resistor joints soldered with leadfree solder by diode laser

作　　者：韩宗杰[1] 薛松柏[1] 王俭辛[1] 禹胜林[1] 费小建[1] 张亮 

机构地区：[1]南京航空航天大学材料科学与技术学院,南京210016

出　　处：《焊接学报》2008年第5期53-56,115,共5页Transactions of The China Welding Institution

基　　金：江苏省普通高校研究生科研创新计划资助项目(CX07B087z);江苏省"六大人才高峰"资助项目(06-E-020)

摘　　要：选用Sn-Ag-Cu无铅钎料,采用半导体激光软钎焊和红外再流焊两种方法对0805型矩形片式电阻元件进行钎焊,并对采用不同方法得到的钎焊焊点进行热循环试验。结果表明,激光软钎焊矩形片式电阻焊点的力学性能优于传统红外再流焊工艺所获得的电阻焊点的力学性能;片式电阻焊点的剪切力随热循环次数的增加呈现下降趋势,在热循环次数相同时,激光软钎焊焊点的力学性能优于红外再流焊焊点。随着热循环次数的增加,片式电阻焊点的剪切断裂的方式由明显的韧性断裂逐渐向脆性断裂转变。Soldering experiments of rectangular chip resistor components were carried out with Sn-Ag-Cu lead-free solder by diode laser soldering system and IR reflow soldering method,respectively,and the thermal cycling test of chip resistor component joints was also carried out.It is found that mechanical properties of chip resistor joints soldered by laser soldering system are better than the ones of chip resistor joints soldered by IR reflow soldering method;shear forces of chip resistor joints decrease gradually ...

关 键 词：矩形片式电阻 Sn-Ag-Cu无铅焊点 半导体激光钎焊 热循环 

分 类 号：TG454[金属学及工艺—焊接]