微电子封装领域焊膏回流曲线的优化研究  

Optimization Thermal Profile of Solder in SMT

作　　者：李松[1] 张同俊[1] 安兵[1] 刘一波[1] 

机构地区：[1]华中科技大学,武汉430074

出　　处：《材料工程》2006年第z1期183-185,共3页Journal of Materials Engineering

摘　　要：对电子封装工业生产中无铅焊料的回流曲线工艺进行了研究,焊料的回流曲线影响界面处的金属间化合物的生成,通过引入加热因子开展研究,同时也进行了焊料的剪切强度实验用于评价封装的可靠性,研究结果表明:较厚的金属间化合物会降低焊球的剪切强度,而回流曲线的优化对焊料焊接的质量,可靠性有很强的实践意义。The process of lead-free solder paste optimization is investigated to fulfill various industrial partners production constrains.A linear thermal profile which is highly recommended by solder paste manufacturers for process can be observed to intermetallic compound(IMC) formation.For package level reliability test,ball shear test is performed to evaluate the joint strength of board and solder balls.Hot matter is put forward.The results exhibit that different intermetallic compound(IMC) formation at solder joints of solder balls is the key to degradation of shear strength.It is concluded that the reflow performances of the solder paste have been validated with success,quality and reliability of solder joint are tested.

关 键 词：热曲线 金属间化合物 剪切强度 

分 类 号：TB741[一般工业技术—材料科学与工程]