MGH956合金TLP扩散连接接头组织分析  

Research on the microstructure of MGH956 superalloy TLP diffusion bonding joints

作　　者：张胜[1] 侯金保[1] 郭德伦[1] 张蕾[1] 

机构地区：[1]北京航空制造工程研究所,北京100024

出　　处：《航空材料学报》2003年第z1期104-108,共5页Journal of Aeronautical Materials

基　　金：武器装备预研基金(5141804020HK5503)

摘　　要：研制了合适的中间层合金KCo2,采用过渡液相(简称TLP)连接方法进行扩散连接试验,分析接头显微组织、成分和连接工艺的关系,分析焊接缺陷形成原因,确定了MGH956合金TLP扩散连接机理。结果表明:在1240℃,保温8小时条件可以获得焊接缺陷少,连续完整的焊接接头。元素实现扩散均匀化。The oxide disperasion strengthened superalloy MGH956 by mechanical alloying can provide good high temperature strength and excellent resistance to high temperature oxidation and corrosion. The interlayer alloy KCo2 has been developed to carry out the TLP diffusion bonding test. The relative aspects have been analyzed about the microstructure of the joint, composition and bonding technologies. The development of microvoids has been explained. The TLP bonding mechanism of MGH956 superalloy has been verified. The experimental results show that the integrated joints with a few defects could be attained on the condition of 1240℃/480min.

关 键 词：ODS合金 钴基中间层 TLP连接 显微组织 

分 类 号：TG453[金属学及工艺—焊接]