LED封装用环氧树脂的导热透明改性  

The Modifying Heat Conductivity and Transparent Ethoxyline Resin Used in LED Packaging

作　　者：万正国[1] 贾虎生[1] 梁建[1] 马淑芳[1] 闫文慧[1] 王连红[1] 

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024

出　　处：《太原理工大学学报》2008年第S1期5-7,共3页Journal of Taiyuan University of Technology

基　　金：国家自然科学基金资助项目(20471041)

摘　　要：采用沉淀转化法,以卤水、碳酸钠为原料,聚乙烯醇(PVA)为改性剂,制备了分散性较好的纳米氧化镁粒子。以纳米MgO为填料,添加环氧树脂AB胶固化体系中,增强固化物的导热性能。研究了纳米MgO经过偶联剂改性后,对原环氧树脂固化系的性能的影响。通过测试,表明纳米MgO对固化物的导热性有增强作用,少量的MgO填充还影响固化物的透光性能。By deposit conversion method,using raw stuff of bittern ,sodium carbonate and modifying agent of PVA,Getted good dispersibility nanometer MgO was prepared.Filling material of MgO was added into epoxide resin solidifying system to intensify its heat conductivity.Studyed performance after modifying by the resin acceptor.By test and measurement,indicated nanometer MgO intensified heat conductivity,and small quantity filling affected light transmission.

关 键 词：环氧树脂 氧化镁 导热 透明 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]