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出 处:《微细加工技术》2007年第4期50-53,64,共5页Microfabrication Technology
基 金:国家863项目资助(2003AA404140)
摘 要:为了提高小量程微压力传感器的灵敏度,提出了一种新结构模型,通过理论分析,发现硅膜越薄,量程越小,灵敏度越高。并对此模型进行ANSYS应力仿真,发现在小量程负荷条件下,新结构模型应力峰值约为10.7 MPa,C型硅杯应力峰值为2.25 MPa,E型硅杯应力峰值为2.8 MPa,通过比较可以看出,优化后的模型提高了微型压力传感器的灵敏性,验证了此模型的合理性。这种优化设计方法对小量程、高灵敏度微型压力传感器的研制具有一定的参考价值。In this work,a news structure model was designed to improve the sensitivity of the micro-pressure sensor with low scale.It is found that the sensitivity of the sensor is enhanced with reduction of the thickness of silicon film and the scale according to theoretical analysis.After the model was simulated with ANSYS software,the results indicated that the pressure peak value of the new structure model is about 10.7 MPa under a low load,while the pressure peak values of the C-and E-type silicon cups are about 2.25 and 2.8 MPa under the some condition,respectively.Compared with these results,the sensitivity of the sensors is enhanced by the optimum structure,indicating that the optimum method can be used a reference for designing of the micro-pressure sensor with low scale and high sensitivity.
分 类 号:TP212[自动化与计算机技术—检测技术与自动化装置]
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