微电铸技术及其工艺优化进展研究  

Microelectroforming Technology and Research Progress of Its Technique Optimization

作　　者：李冠男[1] 黄成军[1] 罗磊[1] 郭旻[2] 于中尧[2] 于军[1] 

机构地区：[1]华中科技大学电子科学与技术系,武汉430074 [2]生物芯片北京国家工程研究中心,北京102206

出　　处：《微细加工技术》2006年第6期1-5,27,共6页Microfabrication Technology

基　　金：国家863计划基金资助项目(2002AA2Z2011)

摘　　要：随着微机电系统(MEMS)和微影微电铸微模铸(LIGA)两种技术的发展,微电铸工艺正逐渐展现着其独特的魅力和发展潜力。然而,现有工艺中存在的缺陷也严重阻碍了其进一步发展。因此,对微电铸工艺进行深入研究,突破其工艺瓶颈,将对微加工工艺的应用和推广起着重要作用。着眼于目前微电铸工艺中存在的不足,从工艺缺陷的理论形成机理出发,总结了近期微电铸领域在工艺缺陷的改进方面所做出的努力及成果,并对微电铸工艺未来的发展趋势提出了一些看法。With the development of MEMS technology and LIGA technology, the microelectroforming technique is revealing its unique fascination and developing potential. However, some problems existing in the technique hinder its further development. So, further research on it, especially removing its bottlenecks, will benefit its application and popularization remarkably. The shortages of the technique were discussed. Beginning with the forming mechanism of these shortages, the recent improvements on the technique were summarized and its developing trends in the future were proposed as well.

关 键 词：微电铸工艺 微影微电铸微模铸 微机电系统 选择性射流电铸 

分 类 号：TQ153.4[化学工程—电化学工业]