基于相对辐射强度的非接触式LED结温测量法  

A new non-contact method based on relative radiation intensity for determining junction temperature of LEDs

作　　者：叶炎钟[1] 郑晓东[1] 刘旭[1] 李海峰[1] 

机构地区：[1]浙江大学现代光学仪器国家重点实验室,浙江杭州310027

出　　处：《光电子．激光》2009年第8期1053-1057,共5页Journal of Optoelectronics·Laser

基　　金：国家重点基础研究发展计划"973"资助项目(2009CB320803);国家高技术研究发展计划"863"资助项目(2007AA01Z339)

摘　　要：提出了一种新的非接触式发光二极管(LED)结温测量的相对辐射强度法。利用该方法对不同功率、不同封装材料、不同颜色的LED进行结温测量,并与正向电压法测得的结果进行比较。结果表明,相对辐射强度法能准确地确定其结温,采用硅凝胶封装的大功率LED,误差在4℃以内;而采用环氧树脂封装的直径5mmLED,当其结温不超过80℃时,误差在6℃以内。A new non-contact method is proposed to determine the junction temperature of LEDs.The junction temperature of LEDs with different power,packaging materials and colors is measured,which is compared with the result obtained by the forward voltage method.The experiment results reveal that it is a good approach to determine the junction temperature for the high-power LEDs that are packeged with soft silicone gel and the error of the junction temperature can be limited within 4 ℃;when the junction temperature i...

关 键 词：LED 结温 测量 非接触 辐射强度 正向电压 

分 类 号：TN312.8[电子电信—物理电子学]