弱界面黏结通用单胞模型理论及应用  

Generalized method of cell with weak interfacial bonding

作　　者：高希光[1,2] 孙志刚[1] 廉英琦[1] 宋迎东[1] 朱如鹏[2] 

机构地区：[1]南京航空航天大学能源与动力学院,南京210016 [2]南京航空航天大学机电学院,南京210016

出　　处：《航空动力学报》2009年第8期1684-1690,共7页Journal of Aerospace Power

基　　金：博士点基金(20070287039);973项目

摘　　要：将通用单胞模型与弱界面分离模型结合.首先推导了增量型通用单胞模型计算公式,然后采用界面位移公式对平均位移连续条件进行改造,建立子胞平均应变增量和宏观应变增量的函数关系.应用子胞增量本构方程得到子胞平均应力增量表达式,采用均匀化方法获得宏观应力增量表达式.最后采用渐进适应界面模型模拟了长纤维复合材料的横向拉伸过程.算例分析表明,将界面分离模型和通用单胞模型结合能较好地模拟复合材料在拉伸载荷下的宏观响应.A generalized method of cell(GMC) with weak interface was developed to model the interface debonding within continuum fiber reinforced composite.To accomplish this work,the average displacement continuum condition between sub-cells in original GMC was modified by employing weak interface theory.Then the average strain of subcell was expressed in terms of global strain.By using the local constitutive equation,the relationship between average stress of subcell and the global strain was established.At last,the...

关 键 词：复合材料 界面脱黏 弱界面 通用单胞模型 计算机模拟 

分 类 号：TB332[一般工业技术—材料科学与工程]