非制冷980nm泵浦激光器封装技术  

Packaging technology of uncooled 980nm pump laser modules

作　　者：李毅[1] 蒋群杰[2] 武斌[2] 张天序[2] 

机构地区：[1]上海理工大学光学与电子工程学院,上海200093 [2]华中科技大学控制科学与工程系,湖北武汉430074

出　　处：《红外与激光工程》2006年第z3期110-114,共5页Infrared and Laser Engineering

基　　金：国家自然科学基金资助项目(60477040)

摘　　要：文中对非制冷980 nm 泵浦激光器的封装技术进行了研究。整个封装技术涉及光学、电学、热学、机械等,精度达微米数量级。采用光纤直接耦合的小型化全金属化封装工艺,以及双布拉格光纤光栅波长锁定技术,最终封装出小型化980 nm 泵浦激光器,其在0～70℃工作温度范围内的出纤功率达120 mW,且具有较好的边模抑制比和波长稳定性。为满足光纤放大器对泵浦激光器大功率、长寿命、高可靠、小尺寸、低功耗、低成本的要求奠定了基础。Packaging technology of uncooled 980 nm pump laser has been studied.The packaging processes with micrometer level precision were concerned with optical performances,electrical control,thermal behavior,and mechanical stress.An output optical power of 120 mW was obtained by using mini-packaging processes without epoxy glue and lensed fiber with double fiber Bragg gratings at operating temperature from 0～70℃.The uncooled 980 nm pump laser module demonstrated can operate at high side mode suppression ratio(SMSR)and wavelength stability.The uncooled pump laser modules are attractive for optical amplifier with high gain,long-term reliability, small package,low cost,and low electrical power consumption.

关 键 词：非制冷 980nm 泵浦激光器 封装技术 

分 类 号：TN24[电子电信—物理电子学]