非制冷高功率半导体泵浦激光器封装技术  

Packaging technology of high power uncooled diode pump laser modules

作　　者：李毅[1] 胡双双[1] 蒋群杰[1] 武斌[1] 俞晓静[1] 

机构地区：[1]上海理工大学光学与电子信息工程学院,上海200093

出　　处：《红外与激光工程》2007年第z1期279-282,共4页Infrared and Laser Engineering

基　　金：国家高科技研究发展计划(863计划)专题课题(2006AA03Z348);教育部科学技术研究重点项目(207033);上海市科学技术委员会科技攻关计划项目(06DZ11415)

摘　　要：非制冷高功率泵浦激光器在大功率、高可靠、小尺寸、低功耗、低成本等方面显现的发展潜力,以及在全固化固体激光器和光纤放大器领域具有的优势,使非制冷高功率泵浦激光器封装技术成为急待突破的核心技术。具体工艺技术涉及光学、电学、热学、机械等,精度要求达微米数量级。系统介绍了泵浦激光器芯片的倒装贴装技术,泵浦激光器的整体结构设计,全金属化无胶封装工艺,波长锁定技术,以及可靠性评估等关键技术,阐述了非制冷高功率泵浦激光器在光通信、工业以及国防等领域的重要应用。High power uncooled diode pump lasers are very attractive in diode-pumped solid-state lasers and optical amplifiers,especially for its advantages of high power,high reliability,small size,low power consumption,and low cost.The packaging technologies of high power uncooled diode pump lasers have been becoming the key technology to be solved.The correlative packaging processes with micrometer level precision are concerned with optical performances,electrical control,thermal behavior,and mechanical stress.The main applications and the key technologies are introduced in this paper,such as pump laser flip-chip mounting technique,the overall structure design of pump laser module,packaging processes without epoxy glue,wavelength locking technology,and performance and reliability assessment,as well as the applications in the industry and military.

关 键 词：非制冷 高功率 泵浦激光器 封装技术 

分 类 号：TN24[电子电信—物理电子学]