高密度3-D封装技术的应用与发展趋势  

Application and development trend of high density three-dimensional packaging technologies

作　　者：顾勇[1] 王莎鸥[2] 赵建明[1] 胡永达[1] 杨邦朝[1] 

机构地区：[1]电子科技大学电子薄膜与集成器件国家重点实验室,四川成都610054 [2]成都电子科学技术研究院,四川成都610054

出　　处：《电子元件与材料》2010年第7期67-70,共4页Electronic Components And Materials

摘　　要：高密度3-D封装技术是国内外近几年飞速发展的微电子封装技术。它在2-D平面基础上向立体化发展,实现了一种新的更高层次的混合集成,因而具有更高的组装密度、更强的功能、更优的性能、更小的体积、更低的功耗、更快的速度、更小的延迟等优势。该技术正在加速未来电子整机系统的微小型化。主要介绍了近年来3-D封装应用状况和一种新型的封装技术——系统上封装SOP(System-on-Package)。High density three-dimensional packaging technologies are rapid developing micro-electronic packaging technologies at home and abroad in recent years. It develops into the three-dimensional space on the basis of the two-dimensional plane. It implements a new and higher level of hybrid integration with higher assemble density, more strong features, better performance, smaller size, lower power consumption, faster speed, smaller delay, etc. Its advantages are accelerating the realization of miniaturization of...

关 键 词：高密度3-D封装 系统芯片 综述 系统上封装 

分 类 号：TN405[电子电信—微电子学与固体电子学]