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作 者:郭焱[1] 马素德[2] 李仲谨[3] 李存本[1]
机构地区:[1]西安交通大学环境与化工学院,陕西西安710049 [2]西安交通大学电气学院,陕西西安710049 [3]陕西科技大学化学化工学院,陕西咸阳712081
出 处:《化学与粘合》2004年第4期241-243,共3页Chemistry and Adhesion
摘 要:分析了淀粉胶难以取代泡花碱胶粘剂的原因,选用新型的催化剂,探讨了各种因素对淀粉氧化和糊化的影响及简要机理,得出了制备淀粉胶的最佳条件为:于40%的淀粉乳中加入5%的氧化剂,在催化剂存在时于58℃下氧化30min,加入10%的NaOH糊化,加填料、加水调节固含量至12%(均以淀粉质量为基准),合成的玉米淀粉胶粘剂成本低、干燥快,有望彻底取代泡花碱。将这种胶粘剂进行了工业化试生产,并对应用情况作了简略介绍。The reasons for sodium silicate solution cement cannot be replaced by starch adhesives were investigated in this paper. In the new method of preparing corn- starch adhesive, a new activator was used and some factors affecting the properties of the starch adhesive were discussed. Results showed that the optimum conditions for preparing cornstarch adhesive are as follows: the concentration of starch corn solution is 40%; the dosage of the oxidizer is 5% (based on the solid content of cornstarch); the dosage of the catalyst is 0.3% (based on the solid content of cornstarch); under the catalysis, at 58℃ the time of the oxidation is 30min; adding 10% NaOH (based on the solid content of cornstarch) for padding; adding fillers and some water to make the solid content of the adhesive within fall tn12%. This kind of cornstarch adhesive was low cost, dried fast. It is passible to replace the sodium silicate solution cement applied in some industrial area.
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