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作 者:王星[1] 张飞虎[1] 张勇[1] 龚翔宇[2] 周明[1]
机构地区:[1]哈尔滨工业大学机电工程学院,哈尔滨150001 [2]哈尔滨工业大学航天学院,哈尔滨150001
出 处:《金刚石与磨料磨具工程》2012年第4期22-26,共5页Diamond & Abrasives Engineering
基 金:国家自然科学基金项目(50805039);高等学校博士点学科专项科研基金项目(20070213049);中国航空科研基金项目(2009ZE77008);哈尔滨工业大学创新基金项目(HIT.NSRIF.2008.40)
摘 要:在研制了纳米胶体动压空化射流抛光原型设备的基础上,使用单晶硅作为工件材料进行空化射流抛光与普通射流抛光的定点抛光对比实验。结果表明:加工角度为90°时,空化射流抛光与普通射流抛光加工轮廓相似,均呈现"W"形状,并且其加工表面质量最好的位置均处在去除最多的圆环处。与普通射流抛光相比,采用旋转导叶喷嘴的空化射流抛光加工效率更高,所得到的表面质量更好。在本实验条件下,加工单晶硅表面得到了Ra0.758 nm的表面粗糙度。The prototype equipment for nano-particle colloid hydrodynamic cavitation jet polishing(HCJP) was prepared and the polishing experiment of HCJP to process single crystal silicon was conducted.The experiment results indicated that,in both cases of HCJP polishing and common jet polishing,the processed area presented an orbicular structure of 'W' shape when the angle of jet was 90°to the horizon.The position that had the best surface quality was located on the annulus of processing region where the most material was removed.Compared with common jet polishing,HCJP had higher polishing efficiency and a better polished surface quality.In the present experiment of HCJP,a supersmooth surface of single crystal silicon of Ra 0.758 nm was obtained.
分 类 号:TB383.1[一般工业技术—材料科学与工程]
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