后处理工艺对硼掺杂金刚石电极膜/基结合性能的影响  

Effect of post-treatment on adhesion stress of boron-doped diamond coated electrode

作　　者：赵鹏[1] 左敦稳[1] 周春[1] 孙达飞[1] 薛海鹏[1] 卢文壮[1] 

机构地区：[1]南京航空航天大学机电学院,南京210016

出　　处：《金刚石与磨料磨具工程》2013年第3期36-39,共4页Diamond & Abrasives Engineering

基　　金：国家自然科学基金(51075211;51275230)资助;教育部博士点基金项目(20113218110018)

摘　　要：为改善硼掺杂金刚石(boron-doped diamond,简称BDD)涂层电极的膜/基结合性能,利用热丝气相沉积法(HFCVD法)制备了BDD涂层电极,研究了退火时间和退火温度对涂层电极上BDD膜的残余应力和膜/基结合性能的影响。采用XRD残余应力测试仪对BDD膜的残余应力进行了测试,采用压痕法对BDD涂层电极膜/基结合性能进行了检测。结果表明:(1)在测试范围内,随退火温度升高、退火时间延长,后处理效果提高;(2)在退火温度700℃、退火时间3 h条件下,涂层电极上BDD膜的残余应力最大可降低45%,BDD涂层电极膜/基结合性能有所提高。The adhesion stress is an important evaluation index of BDD(boron-doped diamond) coated electrode.The BDD coated electrode is prepared by HFCVD.Then the effect of post-treatment on residual stress and adhesion stress of BDD coated electrode is studied.The residual stress of BDD is tested by XRD residual stress analyzer.The adhesion stress is tested by indentation method.The results show that: at the temperature of 700 ℃ and the annealing time of 3 h,the residual stress of the diamond coating release significantly and the adhesion stress is improved.

关 键 词：BDD涂层电极 后处理 残余应力 结合力 

分 类 号：TQ164[化学工程—高温制品工业]