Effects of particle size on the mechanical properties of particle-reinforced Sn-Ag composite solder joint  

作　　者：TAI Feng GUO Fu 

机构地区：[1]College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China

出　　处：《Science China(Technological Sciences)》2009年第1期243-251,共9页中国科学（技术科学英文版）

基　　金：Supported by the New Star Program of Beijing Science and Technology Commission (Grant No.2004B03)

摘　　要：Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.Particulate size has significant influenced on the mechanical properties of particle-reinforced composite solder joints. In this current research, Cu or Ni reinforcement particles were mechanically added to the Sn-3.5Ag eutectic solder, and the effects of the particle size on the mechanical properties of particle-reinforced composite solder joint were systematically studied. This investigation touched on how mechanical properties of the solder joints are affected by particles size. A quantitative formula was set up to correlate the mechanical property of the solder joint with particle size in different processing conditions. Besides, the fracture mechanism of the composite solder joint was analyzed.

关 键 词：COMPOSITE SOLDER size effect MECHANICAL property FRACTURE mechanism 

分 类 号：TB33[一般工业技术—材料科学与工程]