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In-situ Si particle-reinforced joints of hypereutectic Al−60Si alloys by ultrasonic-assisted soldering: 《Transactions of Nonferrous Metals Society of China》2025年第1期77-90,共14页Yuan-xing LI Xiang-bo ZHENG Chao-zheng ZHAO Zong-tao ZHU Yu-jie BAI Hui CHEN; financial support from the National Natural Science Foundation of China(Nos.52275385,U2167216);Sichuan Province Science and Technology Support Program,China(No.2022YFG0086).; To improve the wettability of hypereutectic Al−60Si alloy and enhance the mechanical properties of the joints,Al−60Si alloy was joined by ultrasonic soldering with Sn-9Zn solder,and a sound joint with in-situ Si parti...; 关键词：hypereutectic Al−60Si alloy ultrasonic-assisted soldering Si particle reinforcement Sn−9Zn solder

Effect of trace Zn addition on electromigration of Cu/Sn-10Bi/Cu solder joints: 《Journal of Iron and Steel Research International》2024年第10期2568-2576,共9页Jia-yu Zhang Feng-jiang Wang Yan-xin Qiao; funded by the National Natural Science Foundation of China(Grant No.51875269);Postgraduate Research&Practice Innovation Program of Jiangsu Province(Grant No.SJCX23_2178).; The electromigration reliability on Sn–10Bi solder joints is investigated and the performance is tried to be improved with trace Zn addition in solder by depressing the growth of interfacial intermetallic compounds(I...; 关键词：ELECTROMIGRATION Atomic migration Zn addition Sn–Bi solder Intermetallic compound

Optimization of multicomponent SnBiInSbx low-temperature solder with varied Sb contents: 《Journal of Iron and Steel Research International》2024年第10期2600-2609,共10页Shan-nan Zhang Tian-ran Ding Zong-ye Ding Shi-yan Xie Fu-li Liu Su-juan Zhong Jie Liu Shuai-jie Ma; financially supported by the Key Research and Development Projects in Henan Province,China(231111231500).; The drive toward miniaturization,functionalization,and environmental conservation in electronic devices has increased the demand for low-temperature solder in 3D packaging processes.The influence of Sb incorporation o...; 关键词：Microstructure Low melting point Second-phase strengthening Sb addition Electronic packaging

Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging被引量：1: 《Acta Metallurgica Sinica(English Letters)》2024年第7期1279-1290,共12页Quanzhen Li Chengming Li Xiaojing Wang Shanshan Cai Jubo Peng Shujin Chen Jiajun Wang Xiaohong Yuan; supported by the Yunnan Fundamental Research Projects(No.202301BC070001-001)funded by the Yunnan Provincial Department of Science and Technology;the Yunnan Provincial Science and Technology Plan Project(No.202005AF150045);the Jiangsu Province Industry-University-Research Cooperation Project(No.BY2022832)funded by the Jiangsu Provincial Department of Science and Technology;the National Natural Science Foundation of China(No.52275339).; Different amounts of Fe(0.005,0.01,0.03,0.05,and 0.07 wt%)were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints under thermal loading(170℃,holding time of 0,250,500,and 750 h).The resu...; 关键词：SAC305 solder Fe doping Shear mechanical behavior Isothermal aging Interfacial intermetallic compounds(IMC)

Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium: 《Journal of Materials Science & Technology》2024年第15期246-259,共14页Ancang Yang Yaoping Lu Yonghua Duan Mengnie Li Shanju Zheng Mingjun Peng; supported by the Innovation Team Cultivation Project of Yunnan Province(No.202005AE160016);Key Research&Development Program of Yunnan Province(No.202103AA080017);Yunnan Ten Thousand Talents Plan Young&Elite Talents Project(No.YNWR-QNBJ-2018-044).; The void defect in intermetallic compounds(IMCs)layer at the joints caused by inhomogeneous atomic diffusion is one of the most important factors limiting the further development of Sn-based solders.In this work,the t...; 关键词：Sn-0.7Cu solder IMCs AGING Atomic migration barrier Growth tuning

Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging被引量：1: 《Journal of Iron and Steel Research International》2023年第8期1650-1660,共11页Cheng-ming Li Shu-jin Chen Shan-shan Cai Ju-bo Peng Xiao-jing Wang Ying-wu Wang; support received from Yunnan Fundamental Research Projects(Grant No.202101BC070001-007);the Jiangsu Province Industry-University-Research Cooperation Project(No.BY2022832);the National Natural Science Foundation of China(No.52275339).; The effects of Mn addition(0.005,0.01,0.03,0.05,and 0.07 wt.%)on microstructure,shear mechanical behavior,and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 1...; 关键词：SAC305 solder Mn doping Shear mechanical behavior Isothermal aging Interfacial intermetallic compound

Interfacial reaction behavior and mechanical properties of 5A06 Al alloy soldered with Sn-1Ti-xGa solders at a low temperature: 《China Welding》2023年第2期23-31,共9页宋立志肖勇奚邦富李佳琪张建; the National Natural Science Foundation of China(No.52171045).; Active soldering of 5A06 Al alloy was performed at 300 ℃ by using Sn-1Ti and Sn-1Ti-0.3Ga active solders, respectively. Theeffects of soldering time on the microstructure and mechanical properties of the joints were ...; 关键词：5A06-Al alloy Sn-Ti-Ga solder low-temperature soldering interfacial reaction mechanical properties

Divide and conquer: Machine learning accelerated design of lead-free solder alloys with high strength and high ductility: 《npj Computational Materials》2023年第1期275-284,共10页Qinghua Wei Bin Cao Hao Yuan Youyang Chen Kangdong You Shuting Yu Tixin Yang Ziqiang Dong Tong-Yi Zhang; This work was sponsored by the National Key Research and Development Program of China(No.2018YFB0704400);Key Program of Science and Technology of Yunnan Province(No.202002AB080001-2);Key Research Project of Zhejiang Laboratory(No.2021PE0AC02);Shanghai Pujiang Program(Grant No.20PJ1403700);Guangzhou Municipal Science and Technology Project(No.2023A03J0003).We would like to acknowledge the support from Yunnan Tin Group(Holding)Co.Ltd,China.We also acknowledge the support from the Shanghai Engineering Research Center for Integrated Circuits and Advanced Display Materials.; The attainment of both high strength and high ductility is always the goal for structure materials,because the two properties generally are mutually competing,called strength-ductility trade-off.Nowadays,the data-driv...; 关键词：DUCTILITY STRENGTH SOLDER

Corrosion evolution of high-temperature formed oxide film on pure Sn solder substrate被引量：2: 《Transactions of Nonferrous Metals Society of China》2022年第12期3998-4013,共16页Hui ZHAO Xu SUN Long HAO Jian-qiu WANG Jing-mei YANG; financial support from CAS Key Laboratory of Nuclear Materials and Safety Assessment, Institute of Metal Research, Chinese Academy of Sciences。; The evolution of morphology, composition, thickness and corrosion resistance of the oxide film on pure Sn solder substrate submitted to high-temperature aging in 150 °C dry atmosphere was investigated. The results in...; 关键词：pure Sn solder oxide film high-temperature aging corrosion resistance

Solder Charge连接器连锡故障解决方案: 《电子工艺技术》2022年第6期365-369,共5页孙磊孙勇; Solder charge连接器(SBGA)为高速多引脚互联器件,应用于多种通讯产品的子母板间高速互联。在SMT生产过程中,其故障率一直高于同类焊球型封装BGA器件,主要故障表现为相邻两排引脚短路,且故障率表现与来料批次强相关,通过多种工艺方案不...; 关键词：Solder charge 氧化助焊剂缝隙

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