云南高校图书馆联盟文献共享服务平台- ELECTROMIGRATION

ELECTROMIGRATION: 作品数：48被引量：55H指数：4; 导出分析报告; 相关领域：电子电信更多>>; 相关作者：薩支唐揭斌斌李雪梅张浩孙凤莲更多>>; 相关机构：北京大学中国科学院哈尔滨理工大学中国海洋大学更多>>; 相关期刊：更多>>; 相关基金：国家自然科学基金北京市自然科学基金国家重点基础研究发展计划中国航空科学基金更多>>

Effect of electric current on secondary phase dissolution and elements migration behavior of a Ni-based single crystal superalloy: 《Journal of Iron and Steel Research International》2024年第12期3037-3047,共11页Ying-ju Li Ce Zheng Xiao-hui Feng Qiu-yan Huang Tian-jiao Luo Yuan-sheng Yang; The authors gratefully acknowledge the financial support by the National Key Research and Development Program(No.2018YFA0702900);National Science and Technology Major Project(No.J2019-VII-0002-0142);the National Natural Science Foundation of China(No.51831007).; The second phase dissolution and elements migration behavior of a nickel-based single crystal superalloy during solution heat treatment with direct current were investigated for simplifying and shortening the solution...; 关键词：Ni-based single crystal superalloy Electric current Solution heat treatment ELECTROMIGRATION Element segregation

Effect of trace Zn addition on electromigration of Cu/Sn-10Bi/Cu solder joints: 《Journal of Iron and Steel Research International》2024年第10期2568-2576,共9页Jia-yu Zhang Feng-jiang Wang Yan-xin Qiao; funded by the National Natural Science Foundation of China(Grant No.51875269);Postgraduate Research&Practice Innovation Program of Jiangsu Province(Grant No.SJCX23_2178).; The electromigration reliability on Sn–10Bi solder joints is investigated and the performance is tried to be improved with trace Zn addition in solder by depressing the growth of interfacial intermetallic compounds(I...; 关键词：ELECTROMIGRATION Atomic migration Zn addition Sn–Bi solder Intermetallic compound

Migration Behavior of Impurity Iron in Silicon Melt Under Pulsed Electric Current: 《Acta Metallurgica Sinica(English Letters)》2024年第5期889-903,共15页Mengcheng Zhou Yaxiong Dai Changhao Liu Shengli Ding Xinfang Zhang; financially supported by the National Natural Science Foundation of China(No.U21B2082);Natural Science Foundation of Beijing Municipality(No.2222065);and Fundamental Research Funds for the Central Universities(No.FRF-TP-22-02C2).; The impurity iron in silicon material will seriously affect the photoelectric conversion efficiency of silicon solar cells.However,the traditional silicon purification method has the disadvantages of long cycle,high e...; 关键词：Metallurgical silicon Pulsed electric current Iron-rich phase Current density gradient ELECTROMIGRATION

Hydrogen evolution and electromigration in the corrosion of aluminium metal sheath inside high‐voltage cables被引量：13: 《High Voltage》2022年第2期260-268,共9页Yidong Chen Kai Zhou Jiamin Kong Shakeel Akram Xiancheng Ren Xiaoshan Zhang Yuan Li Qi Zhao; The urgent need for power transmission is the reason for leading research on the safer operation of high‐voltage cables.These high‐voltage cables are emerging as an efficient technology for underground power transmi...; 关键词：CORROSION process. ELECTROCHEMICAL

A physics-based electromigration reliability model for interconnects lifetime prediction: 《Science China(Information Sciences)》2021年第11期253-254,共2页Linlin CAI Wangyong CHEN Jinfeng KANG Gang DU Xiaoyan LIU Xing ZHANG; supported by National Natural Science Foundation of China(Grant No.61674008);National Key Research and Development(Grant No.2016YFA0202101)。; Dear editor,When the technology node scales down to 14 nm, the backend-of-line(BEOL) in IC design faces the more serious challenges [1, 2]. The high-density integration induced by the technology innovation increases t...; 关键词：LIFETIME PREDICTION EDITOR

Temperature-Aware Electromigration Analysis with Current-Tracking in Power Grid Networks: 《Journal of Computer Science & Technology》2021年第5期1133-1144,共12页Jing Wang Yi-Ci Cai Qiang Zhou; supported by the National Natural Science Foundation of China under Grant No.61774091;the Key Research and Development Program of China under Grant No.2019YFB2205001.; Electromigration(EM)is a severe reliability issue in power grid networks.The via array possesses special EM characteristics and suffers from Joule heating and current crowding,closely related to EM violations.In this ...; 关键词：electromigration(EM) SELF-HEATING thermal coupling VIA

Integration of machine learning with phase field method to model the electromigration induced Cu_(6)Sn_(5) IMC growth at anode side Cu/Sn interface被引量：3: 《Journal of Materials Science & Technology》2020年第24期203-219,共17页Anil Kunwar Yuri Amorim Coutinho Johan Hektor Haitao Ma Nele Moelans; financially supported by the KU Leuven Research Fund(C14/17/075);the National Natural Science Foundation of China(No.51871040);the European Research Council(ERC)under the European Union’s Horizon 2020 research and innovation program(INTERDIFFUSION,No.714754)。; Currently,in the era of big data and 5G communication technology,electromigration has become a serious reliability issue for the miniaturized solder joints used in microelectronic devices.Since the effective charge nu...; 关键词：Phase field method Artificial neural network Intemetallic compound Current density Synchrotron radiation

Energy variation in diffusive void nucleation induced by electromigration: 《Acta Mechanica Sinica》2020年第4期866-872,共7页Yuexing Wang Yao Yao Zhang Long Leon Keer; support by the National Natural Science Foundation of China(Grant 11772257);Natural Science Foundation of Shaanxi Providence(Grant 2020JM-103);Fundamental Research Funds for the Central Universities(Grant G2019KY05212).; An energy approach is proposed to describe electromigration induced void nucleation based on phase transformation theory.The chemical potential for an individual migrated atom is predicted by diffusion induced back st...; 关键词：ENERGY ELECTROMIGRATION Void nucleation DIFFUSION

An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures: 《Theoretical & Applied Mechanics Letters》2020年第1期33-37,共5页Yuexing Wang Yao Yao Leon Keer; The authors would like to acknowledge the financial support by the National Natural Science Foundation of China(Grants 11572249 and 11772257);the Fundamental Research Funds for the Central Universities(Grant G2019KY05212).; A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds(IMC)in the Cu-Sn-Cu sandwich structure.The proposed model is based on the local interfacial mass conversation law w...; 关键词：Intermetallic compounds Polarity effect ELECTROMIGRATION DIFFUSION Size effect

Enhancement of Effective Accumulation of Atoms during Fabrication of Al Microsphere: 《Microscopy Research》2019年第4期39-46,共8页Faizul Mohammad Kamal Md. Nazrul Islam Khan; Microspheres of Al have been successfully fabricated utilizing electromigration using sudden change in geometrical shape of a specimen. The experimental sample was a passivated Al line with a hole at the transitional ...; 关键词：ELECTROMIGRATION ATOMS MIGRATION MICROSPHERE ACCUMULATION

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