An analytical model to predict diffusion induced intermetallic compounds growth in Cu-Sn-Cu sandwich structures  

作　　者：Yuexing Wang Yao Yao Leon Keer 

机构地区：[1]Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang 621999,China [2]School of Mechanics,Civil Engineering and Architecture,Northwestern Polytechnical University,Xi'an 710072,China [3]Department of Civil and Environmental Engineering,Northwestern University,Evanston,IL 60208,USA

出　　处：《Theoretical & Applied Mechanics Letters》2020年第1期33-37,共5页力学快报（英文版）

基　　金：The authors would like to acknowledge the financial support by the National Natural Science Foundation of China(Grants 11572249 and 11772257);the Fundamental Research Funds for the Central Universities(Grant G2019KY05212).

摘　　要：A mass diffusion model is developed to describe the growth kinetics of Cu6Sn5 intermetallic compounds(IMC)in the Cu-Sn-Cu sandwich structure.The proposed model is based on the local interfacial mass conversation law where interfacial Cu/Sn reactions and atomic diffusion are considered.Theoretical analysis shows that the IMC thickness growth is proportional to the square root of the product of the diffusion coefficient and time.The proposed model can explain the polarity effect of electromigration on kinetics of IMC growth where all the parameters have clear physical meaning.The theoretical predictions are compared with experimental results and show reasonable accuracy.

关 键 词：Intermetallic compounds Polarity effect ELECTROMIGRATION DIFFUSION Size effect 

分 类 号：TG42[金属学及工艺—焊接]