Solder Charge连接器连锡故障解决方案  

Solution to Solder Charge Connector Bridge Failure

作　　者：孙磊[1] 孙勇[1] SUN Lei;SUN Yong(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)

机构地区：[1]中兴通讯股份有限公司,广东深圳518057

出　　处：《电子工艺技术》2022年第6期365-369,共5页Electronics Process Technology

摘　　要：Solder charge连接器(SBGA)为高速多引脚互联器件,应用于多种通讯产品的子母板间高速互联。在SMT生产过程中,其故障率一直高于同类焊球型封装BGA器件,主要故障表现为相邻两排引脚短路,且故障率表现与来料批次强相关,通过多种工艺方案不能完全解决连锡问题。通过分析Solder charge连接器结构和材料,找到器件连锡的根因,提出了此类器件的设计和焊接改善方案,并进行了实际生产验证,为业界Solder charge连接器(SBGA)类器件焊接提供了可行的解决方案。Solder charge connector(SBGA)is a high-speed multi-pin interconnection device,which is applied to high-speed interconnection between mother and daughter boards in various communication products.In SMT process,its failure rate is always higher than that of similar ball grid array package devices,and the main fault is the short circuit between two adjacent pins.The performance of failure rate is strongly related to the lot of material,and the problem of solder connection cannot be completely solved through various process.By analyzing the structure and the material of solder charge connector,the root cause of bridge of between the solder pin is found,the improvement schemes for the design and soldering of such devices are proposed,and the actual production verification is carried out.It provides a feasible solution for solder charge connector devices soldering in the industry.

关 键 词：Solder charge 氧化 助焊剂 缝隙 

分 类 号：TN605[电子电信—电路与系统]