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作 者:马李[1]
机构地区:[1]台州学院物理与电子工程学院,浙江台州318000
出 处:《材料工程》2009年第S2期319-322,327,共5页Journal of Materials Engineering
基 金:新世纪优秀人才支持计划资助(NCET2004)
摘 要:为满足金属热防护系统面板材料的轻量化要求,以Ti-Al金属间化合物作为基体,以Ti作为增韧层,利用电子束物理气相沉积技术和双靶沉积方法,制备了Ti/Ti-Al微层板,并利用热压法对材料进行了致密化处理。采用纳米压痕法和常温拉伸试验对材料的力学性能进行了表征,根据断口形貌和结构特征,分析了材料的增韧机制。结果表明:添加金属韧化层使TiAl基合金的室温力学性能有所提高,微层板中的裂纹多次沿着层间界面或层中拐折,表现出良好的断裂延迟特性,其增韧机制则为韧化层的存在导致裂纹发生偏转、微桥接等使裂纹扩展阻力增加。To satisfy the need for lightweight materials used on panel of metal thermal protection system,Ti-Al intermetallic compound and pure Ti have been selected to be as parent material and flexibility-enhanced material respectively.Large sized Ti/Ti-Al micro laminated sheet was deposited by EB-PVD technology with dual-target in this work and then the mechanical properties of materials was characterized using nanoindentation and tensile test at room or high temperature,and the toughening mechanism was analyzed according to fractography and structure characteristics of materials.The results show that the addition of Ti ductility layer can improve the mechanical properties of Ti-Al alloy at room temperature.The cracks will stagger along the interlaminar interface or the layer due to which microlaminate expresses a good characteristic of delayed fracture.The toughening mechanisms are that the crack deflection and micro-bridge connection caused by the toughening layers increases crack propagation resistance.
分 类 号:TB302.3[一般工业技术—材料科学与工程]
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