一种综合评价覆铜板脆韧性的表征方法的研究  

A Test Method Research on Evaluation of the Toughness of Copper Clad Laminate

作　　者：吕吉[1] 陈玉娥[1] 苏晓声[1] 李远[1] 

机构地区：[1]广东生益科技股份有限公司

出　　处：《印制电路信息》2009年第S1期514-516,共3页Printed Circuit Information

摘　　要：迄今为止,现有的方法都无法准确表征覆铜板的脆韧性。可评判金属及塑料样品脆韧性的测试方法,都不能直接评判覆铜板样品。由于覆铜板中多层玻璃布粘合的影响,使得这些测试方法只能反映某一方面的性能。本文采用叠加公式法进行综合评判,可以准确地反映覆铜板的脆韧性。The test methods available at present for characterizing the toughness of Copper Clad laminate are not accurate yet,however,the methods tailored for testing metals and plastics are not feasible to Copper Clad laminate because of the impacts of multilayer woven glass fabric,which could only reflect certain aspects of performances.The thesis adopted Superposition Formula to evaluate the toughness of Copper Clad laminate integratively and accurately.

关 键 词：覆铜板 脆韧性 叠加公式法 

分 类 号：TN41[电子电信—微电子学与固体电子学]