利用化学镀和激光照射在有机树脂基板形成微细图形  

Fine Pattern Forming on Organic Resin Substrate by Electroless Plating and Laser Radiation

作　　者：蔡积庆 

出　　处：《印制电路信息》2009年第10期34-38,53,共6页Printed Circuit Information

摘　　要：概述了利用化学镀和激光照射形成PCB的微细铜图形。玻璃纤维环氧树脂板浸渍于Pd2+溶液中,采用化学镀铜在环氧树脂上沉积铜层。镀铜以后采用脉冲Nd-YAG激光通过可变虹彩膜片和凸透镜照射到镀铜层样品上,以便在空气中或二次蒸馏水中局部的除去铜。铜除去区域的宽度随着激光功率的增加而增加,随着激光束扫描速率的降低而增加。当在二次蒸馏水中照射激光时,激光照射区域周围的铜层卷起,结果形成不清晰的图形。在空气中照射激光,可以在环氧树脂上形成宽度/间隙为60μm/20μm的微细铜图形线圈。This paper describes a PCB with a fine Cu pattern fabricated by electroless plating and laser irradiation.A glass fiber-reinforced epxy resin plate was immersed in a Pd2+solution and a Cu layer was then deposited on the epoxy resin by Cu electroless plating.After Cu plating,the Cu deposited specimen was irradiated with a pulsed Nd-YAG caser through a iris diaphragm and a convex lens to remove the Cu layer locally in air or doubly distilled water.The width of the Cu removed area increased with increasing the laser power and with decreasing the scanning rate of the laser beam.When laser irradiation was performed in doubly distilled water, the Cu layer around the laser-irradiated area rolled up,resulting in the formation of less precise patterns.Fine Cupattern coils with 60μm width and 20μm intervals were fabricated on the epoxy resin by laser irradiation in air.

关 键 词：化学镀 激光照射 微机械加工 印制板 

分 类 号：TN41[电子电信—微电子学与固体电子学]