基于MSC的装配结构模态分析技术研究  

Research on the Mode Analysis of the Assembly Structures Based on MSC

作　　者：赵猛[1] 张以都[1] 马良文[1] 赵丽丽[1] 

机构地区：[1]北京航空航天大学机械工程及自动化学院,北京100083

出　　处：《机械科学与技术》2003年第S2期102-104,共3页Mechanical Science and Technology for Aerospace Engineering

摘　　要：在装配结构按合面处添加附加面,利用多点约束(MPC)技术,将装配结构连接在一起,通过合理定义附加面的材料属性皋达到模拟装配零件之间实际连接刚度的目的。在MSC/Nastran平台上,对一种典型的、经过附加面处理的装配结构进行了棋态分析、并与刚性连接、一体化结构的模态分析结果进行了比较,得出了十分有益的结论,对实现复杂装配结构的模态分析具有重要参考意义。By attaching an auxiliary surface between the assembled parts, defining the material properties of the auxiliary surface and connecting the assembled parts with the Multi-Point Constraints (MPC) technique from MSC, the practical connecting stiffness of the assembly structure can be simulated. Based on the platform of MSC/ Nastran, the mode analysis of a typical assembly structure with the auxiliary surface is carried out. The mode analysis results of the assembly structure are compared with those of a corresponding rigid and integfative structure. The method of auxiliary surface can be very beneficial to the mode analysis of the complex assembly structures.

关 键 词：装配结构 MPC 有限元分析 附加面 连接刚度 

分 类 号：TH113.1[机械工程—机械设计及理论]