多层介质结构LC带通滤波器的交叉耦合设计  被引量:2

Design of LC Bandpass Filter with Cross-Coupling Constructed on Multilayer Substrates

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作  者:曹珂[1] 李启伟[1] 程崇虎[2] 

机构地区:[1]南京邮电大学电子科学与工程学院,南京210003 [2]南京邮电大学通信与信息工程学院,南京210003

出  处:《新型工业化》2013年第2期79-85,共7页The Journal of New Industrialization

基  金:国家自然科学基金(61071020);高等学校博士学科点专项科研基金资助课题(20080293004)

摘  要:本文给出了一种基于LTCC技术的多层介质结构带通滤波器模型,并用交叉耦合的方法从相位的角度对其等效电路图进行了分析,解释了传输零点产生的原因。为验证解释的正确性,在将等效电路图进行改动后再次进行了相位分析和仿真,二者的结论相符合。给出的滤波器模型具有5个金属层和4个介质层,总体尺寸为6mm×6mm×1.25mm,中心频率为2.45GHz,3d B带宽约为340MHz。在设计时采用了独特的电感结构,并用缝隙电容实现了源和负载之间的交叉耦合,从而保持了结构的紧凑。模型的仿真结果与电路仿真的结果相符,展示出了滤波器所具有的良好性能。A bandpass filter constructed on multilayer substrates using LTCC technology was proposed in this paper and the mechanisms producing transmission zeros were revealed by analyzing its equivalent circuit schematic in terms of phase and cross-coupling. To verify this analysis, a modified schematic was analyzed and simulated. The simulation results agree with the analysis again. The proposed filter, working at 2.45 GHz while the 3d B bandwidth is about 340 MHz, is consisted of 5 metal layers and 4 substrate layers and the overall size is about 6mm×5mm×1.25 mm. By taking advantages of a unique inductor structure and a gap capacitor, which realized the cross-coupling between the source and load, the filter structure was designed compactly. Simulation results of the physical structure were found in agree with circuit model simulation results and both of them exhibited the favorable performance.

关 键 词:低温共烧陶瓷 带通滤波器 交叉耦合 传输零点 

分 类 号:TB3[一般工业技术—材料科学与工程] O22[理学—运筹学与控制论]

 

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