单晶铜/多晶铜闪光对焊接头组织的演变  

Microstructure Evolution of Flash Butt Welding Joint Between Single Crystal Copper and Poly-crystal Copper

作　　者：李炳[1] 范新会[1] 王鑫[1] 陈建[1] 严文[1] 

机构地区：[1]西安工业大学材料与化工学院,西安710021

出　　处：《西安工业大学学报》2013年第8期648-651,共4页Journal of Xi’an Technological University

基　　金：陕西省自然科学基础研究计划项目资助(2010JM6015)

摘　　要：电阻焊在焊接单晶铜/多晶铜时,可使焊接热过程对单晶组织影响最小化.采用不同焊接电流,对单晶铜/多晶铜进行闪光对焊,对焊接接头的热影响区宽度和显微组织进行了分析.结果表明:闪光对焊对多晶铜组织的影响极为显著,随着离焊缝距离的增加,依次呈现出粗晶区、细晶区、超细晶区、超细晶与母材混合区.单晶铜一端仅在近缝处的极小范围内发生了再结晶行为.When single crystal copper and poly-crystal copper (PCC ) were welded by resistance welding ,the effect on single crystal copper(SCC) is very small .For SCC and PCC by flash butt welding with different welding currents ,the width of heat affected zone and microstructures of welded joint were investigated .The results showed that flash butt welding made significant changes in the microstructure of PCC .Coarse grain area ,fine grain area ,super fine grain area ,super fine crystal mixed with the base metal zone can be observed with increase of the distance from the welding seam .However , recrystallization happened just in tiny range nearby the welding seam for single crystal copper .

关 键 词：单晶铜 闪光对焊 焊接电流 热影响区 

分 类 号：TG113.25[金属学及工艺—物理冶金]