玻纤布增强导热覆铜箔层压板  

Glass fiber reinforced thermal conductive CCL

作　　者：黄增彪[1] 邓华阳[1] 叶晓敏[1] 

机构地区：[1]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523808

出　　处：《印制电路信息》2013年第S1期22-27,共6页Printed Circuit Information

摘　　要：电子产品的多功能化、薄型化要求PCB轻薄短小,电子元器件安装密度高,因此发热量大,为了保证电子元器件寿命及产品的可靠性,热管理显得越来越重要。基于以上应用需求,文章旨在介绍一种玻纤布增强导热覆铜箔层压板及其粘结片,该板材热导率比传统FR-4高3~5倍,加工性相对良好,如钻头磨损相对于多数同类产品较小,更低热膨胀系数(CTE),高可靠性,粘结片层压工艺与传统无铅FR-4兼容,满足无铅制程要求。With the tendency of multifunction and thinning of electronic product, the requirement for PCB is better to be Light-Thin-Small-Short. The density of electronic component is increasing. Thus the more heat of electronic product occurs. To guarantee the electronic component's life and the reliability of product, thermal management is considered more and more important. According to above requirement of application, this article mainly introduces a kind of glass fiber reinforced CCL which is higher 3~5 times than conventional FR-4 in thermal conductivity, relative good in PCB process, such as lower drilling loss than similar product, lower CTE, high reliability, compatible laminating process of conventional lead-free solder product, and meets the requirement of lead-free solder process.

关 键 词：覆铜箔层压板 热导率 内层厚铜 热膨胀系数 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]