银活化液在PCB化学镀铜的研究  

Study of silver activating solution used in PCB electroless copper plating

作　　者：杨琼[1] 陈世荣[1] 汪浩[1] 曹权根 王恒义 谢金平 范小玲 

机构地区：[1]广东工业大学,广东广州510006 [2]广东致卓精密金属科技有限公司,广东佛山528231

出　　处：《印制电路信息》2013年第S1期116-119,共4页Printed Circuit Information

摘　　要：文章简述了印制电路板孔金属化用的各种钯活化液的原理和特点,提出了一种银活化液,并将其催化活性和催化效果与胶体钯进行了对比。结果表明银活化用于化学镀铜,诱导时间快,可以节约成本。This paper describes the principles and characteristics of various PCB plated through hole palladium activating solution, we propose a silver activation solution and its catalytic activity and catalytic effects were compared with colloidal palladium. The results show that silver activation solution can quickly induce electroless copper plating, and save production cost.

关 键 词：印制电路板 化学镀铜 钯活化液 银活化液 

分 类 号：TN41[电子电信—微电子学与固体电子学]